Self-Sensing Cantilevers with Silicon Tip
Silicon piezo-resistive sensing cantilevers
General description
Piezo-Resistive Sensing (PRS) and Piezo-Resistive Sensing Active (PRSA) probes are designed for various scanning probe microscopy applications. They are silicon cantilevers with integrated piezo-resistors on-chip for self-sensing and, in the case of PRSA probes, a heater for self-actuating. The piezo-resistors are integrated into a matched Wheatstone bridge for high sensitivity and minimizing environmental thermal drift. By using the self-sensing readout, no laser adjustment is necessary in comparison to conventional optical readout AFM systems. This saves time during a cantilever change. The free space above the cantilever enables new applications and combination of AFM with various instruments. The silicon tips are designed for high-precision with a nominal tip apex radius of <15nm. The cantilevers are available in different lengths and can be shipped either as bare chip (CHP version) or bonded to a small printed circuit board (PCB version) with a small connector for a quick cantilever change. The cantilever PCB can be connected to a low-noise pre-amplifier (e.g. our NanoOne or NanoPro preamplifiers) by using our flexible counter-part PCB.
Applications
- Integration on a standard AFM scanner and high-speed AFM
- Force or deflection measurements within TEM, SEM, XPS, etc.
What about your application?
PRS / PRSA Piezoresistive Cantilevers (Si Tip): Specifications
| Parameter | Value (all models) |
|---|---|
| Material | Silicon cantilever, boron doped 1k Ohm piezo resistors, aluminium tracks |
| Deflection sensing | On-chip piezo-resistive bridge |
| Electrical connections | Bonded to small PCB with connector (counterpart PCB available) or delivered as bare chip (bonding pads on-chip) |
| Chip dimensions (h, w, l) | 0.3 / 1.2 / 2.5 mm |
| Tip radius (apex) | <25 nm |
| Tip height | 4…7 µm |
| Tip material | Silicon |
Model-Specific Specifications
| Model* | Resonant Freq. (nominal) | Spring Const. (calc.) | Sensitivity** | Force Sensitivity** | Length, Width | Actuator | Bonded/Unbonded |
|---|---|---|---|---|---|---|---|
| PRS-L70-F900-Si-CHP | 500…1300 kHz | 35…400 N/m | 3 µV/nm | 23…400 nN/µV | 70 ±5 µm, 30 ±3 µm | External shaker | unbonded (bare chip) |
| PRS-L70-F900-Si-slPCB | 500…1300 kHz | 35…400 N/m | 3 µV/nm | 23…400 nN/µV | 70 ±5 µm, 30 ±3 µm | External shaker | bonded to PCB |
| PRS-L100-F500-Si-CHP | 200…800 kHz | 6…300 N/m | 1…3 µV/nm | 2…300 nN/µV | 100 ±5 µm, 48 ±3 µm | External shaker | unbonded (bare chip) |
| PRS-L100-F500-Si-slPCB | 200…800 kHz | 6…300 N/m | 1…3 µV/nm | 2…300 nN/µV | 100 ±5 µm, 48 ±3 µm | External shaker | bonded to PCB |
| PRSA-L100-F500-Si-CHP | 200…800 kHz | 6…300 N/m | 1…3 µV/nm | 2…300 nN/µV | 100 ±5 µm, 48 ±3 µm | External shaker or on-chip heater (11 ±2 Ohm) | unbonded (bare chip) |
| PRSA-L100-F500-Si-slPCB | 200…800 kHz | 6…300 N/m | 1…3 µV/nm | 2…300 nN/µV | 100 ±5 µm, 48 ±3 µm | External shaker or on-chip heater (11 ±2 Ohm) | bonded to PCB |
| PRS-L300-F60-Si-CHP | 30…95 kHz | 2…56 N/m | 1…2 µV/nm | 1…56 nN/µV | 300 ±5 µm, 68 ±3 µm | External shaker | unbonded (bare chip) |
| PRSA-L300-F60-Si-CHP | 30…95 kHz | 2…56 N/m | 1…2 µV/nm | 1…56 nN/µV | 300 ±5 µm, 68 ±3 µm | External shaker or on-chip heater (11 ±2 Ohm) | unbonded (bare chip) |
| PRS-L300-F80-Si-slPCB | 65…95 kHz | 15…56 N/m | 1…2 µV/nm | 7…56 nN/µV | 300 ±5 µm, 68 ±3 µm | External shaker | bonded to PCB |
| PRSA-L300-F80-Si-slPCB | 65…95 kHz | 15…56 N/m | 1…2 µV/nm | 7…56 nN/µV | 300 ±5 µm, 68 ±3 µm | External shaker or on-chip heater (11 ±2 Ohm) | bonded to PCB |
| PRS-L300-F50-Si-slPCB | 30…65 kHz | 2…15 N/m | 1…2 µV/nm | 1…15 nN/µV | 300 ±5 µm, 68 ±3 µm | External shaker | bonded to PCB |
| PRSA-L300-F50-Si-slPCB | 30…65 kHz | 2…15 N/m | 1…2 µV/nm | 1…15 nN/µV | 300 ±5 µm, 68 ±3 µm | External shaker or on-chip heater (11 ±2 Ohm) | bonded to PCB |
| PRS-L460-F30-Si-CHP | 15…40 kHz | 0.7…9.3 N/m | 1…2 µV/nm | 0.3…9.3 nN/µV | 460 ±5 µm, 100 ±3 µm | External shaker | unbonded (bare chip) |
| PRS-L460-F30-Si-slPCB | 15…40 kHz | 0.7…9.3 N/m | 1…2 µV/nm | 0.3…9.3 nN/µV | 460 ±5 µm, 100 ±3 µm | External shaker | bonded to PCB |
| PRSA-L460-F30-Si-CHP | 15…40 kHz | 0.7…9.3 N/m | 1…2 µV/nm | 0.3…9.3 nN/µV | 460 ±5 µm, 100 ±3 µm | External shaker or on-chip heater (11 ±2 Ohm) | unbonded (bare chip) |
| PRSA-L460-F30-Si-slPCB | 15…40 kHz | 0.7…9.3 N/m | 1…2 µV/nm | 0.3…9.3 nN/µV | 460 ±5 µm, 100 ±3 µm | External shaker or on-chip heater (11 ±2 Ohm) | bonded to PCB |
* Electrical characterization is only possible for bonded cantilevers.
** Measured without amplification, 2.048 V bridge supply.
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View leafletNot sure which cantilever fits your experiment?
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