Silicon cantilevers · Tipless

Tipless Silicon Self-Sensing Cantilevers

Silicon piezo-resistive sensing cantilevers

General description

Piezo-Resistive Sensing (PRS) and Piezo-Resistive Sensing Active (PRSA) probes are designed for various scanning probe microscopy applications. They are silicon cantilevers with integrated piezo-resistors on-chip for self-sensing and, in the case of PRSA probes, a heater for self-actuating.

The piezo-resistors are integrated into a matched Wheatstone bridge for high sensitivity and minimizing environmental thermal drift. By using the self-sensing readout, no laser adjustment is necessary in comparison to conventional optical readout AFM systems. This saves time during a cantilever change.

The free space above the cantilever enables new applications and combination of AFM with various instruments. The cantilevers are available in different lengths and can be shipped either as bare chip (CHP version) or bonded to a small printed circuit board (PCB version) with a small connector for a quick cantilever change. The cantilever PCB can be connected to a low-noise pre-amplifier (e.g. our NanoOne or NanoPro preamplifiers) by using our flexible counter-part PCB.

Applications

Integration on a standard AFM scanner and high-speed AFM
Force or deflection measurements within TEM, SEM, XPS, etc.

What about your application?

PRS / PRSA Piezoresistive Cantilevers: Specifications

Parameter	Value (all models)
Material	Silicon cantilever, boron doped 1k Ohm piezo resistors, aluminium tracks
Deflection sensing	On-chip piezo-resistive bridge
Electrical connections	Bonded to small PCB with connector (counterpart PCB available) or delivered as bare chip (bonding pads on-chip)
Chip dimensions (h, w, l)	0.3 / 1.2 / 2.5 mm

Model-Specific Specifications

Model*	Resonant Freq. (nominal)	Spring Const. (calc.)	Sensitivity**	Force Sensitivity**	Length, Width	Actuator	Bonded/Unbonded
PRS-L70-F900-TL-CHP	500…1300 kHz	35…400 N/m	3 µV/nm	23…400 nN/µV	70 ±5 µm, 30 ±3 µm	External shaker	unbonded (bare chip)
PRS-L70-F900-TL-slPCB	500…1300 kHz	35…400 N/m	3 µV/nm	23…400 nN/µV	70 ±5 µm, 30 ±3 µm	External shaker	bonded to PCB
PRS-L100-F500-TL-CHP	200…800 kHz	6…300 N/m	1…3 µV/nm	2…300 nN/µV	100 ±5 µm, 48 ±3 µm	External shaker	unbonded (bare chip)
PRS-L100-F500-TL-slPCB	200…800 kHz	6…300 N/m	1…3 µV/nm	2…300 nN/µV	100 ±5 µm, 48 ±3 µm	External shaker	bonded to PCB
PRSA-L100-F500-TL-CHP	200…800 kHz	6…300 N/m	1…3 µV/nm	2…300 nN/µV	100 ±5 µm, 48 ±3 µm	External shaker or on-chip heater (11 ±2 Ohm)	unbonded (bare chip)
PRSA-L100-F500-TL-slPCB	200…800 kHz	6…300 N/m	1…3 µV/nm	2…300 nN/µV	100 ±5 µm, 48 ±3 µm	External shaker or on-chip heater (11 ±2 Ohm)	bonded to PCB
PRS-L300-F60-TL-CHP	30…95 kHz	2…56 N/m	1…2 µV/nm	1…56 nN/µV	300 ±5 µm, 68 ±3 µm	External shaker	unbonded (bare chip)
PRSA-L300-F60-TL-CHP	30…95 kHz	2…56 N/m	1…2 µV/nm	1…56 nN/µV	300 ±5 µm, 68 ±3 µm	External shaker or on-chip heater (11 ±2 Ohm)	unbonded (bare chip)
PRS-L300-F80-TL-slPCB	65…95 kHz	15…56 N/m	1…2 µV/nm	7…56 nN/µV	300 ±5 µm, 68 ±3 µm	External shaker	bonded to PCB
PRSA-L300-F80-TL-slPCB	65…95 kHz	15…56 N/m	1…2 µV/nm	7…56 nN/µV	300 ±5 µm, 68 ±3 µm	External shaker or on-chip heater (11 ±2 Ohm)	bonded to PCB
PRS-L300-F50-TL-slPCB	30…65 kHz	2…15 N/m	1…2 µV/nm	1…15 nN/µV	300 ±5 µm, 68 ±3 µm	External shaker	bonded to PCB
PRSA-L300-F50-TL-slPCB	30…65 kHz	2…15 N/m	1…2 µV/nm	1…15 nN/µV	300 ±5 µm, 68 ±3 µm	External shaker or on-chip heater (11 ±2 Ohm)	bonded to PCB
PRS-L460-F30-TL-CHP	15…40 kHz	0.7…9.3 N/m	1…2 µV/nm	0.3…9.3 nN/µV	460 ±5 µm, 100 ±3 µm	External shaker	unbonded (bare chip)
PRS-L460-F30-TL-slPCB	15…40 kHz	0.7…9.3 N/m	1…2 µV/nm	0.3…9.3 nN/µV	460 ±5 µm, 100 ±3 µm	External shaker	bonded to PCB
PRSA-L460-F30-TL-CHP	15…40 kHz	0.7…9.3 N/m	1…2 µV/nm	0.3…9.3 nN/µV	460 ±5 µm, 100 ±3 µm	External shaker or on-chip heater (11 ±2 Ohm)	unbonded (bare chip)
PRSA-L460-F30-TL-slPCB	15…40 kHz	0.7…9.3 N/m	1…2 µV/nm	0.3…9.3 nN/µV	460 ±5 µm, 100 ±3 µm	External shaker or on-chip heater (11 ±2 Ohm)	bonded to PCB