QCT Cantilever Probes
Silicon Nitride-Polymer AFM probes for low-temperature experiments
General description
The Quantum Cryogenic Trilayer (QCT) Cantilevers are engineered with an innovative trilayer structure combining silicon nitride films with a polymer core. This design increases thickness without adding excessive stiffness, delivering up to 4x higher force sensitivity (μV/nN) compared to standard single-crystalline silicon cantilevers. The SiN/Polymer interface provides excellent electrical insulation, ensuring sensor reliability and durability—even in demanding environments. Platinum traces on the cantilever surface efficiently transfer signals to the tip, while remaining electrically isolated from the integrated Wheatstone bridge.
Optimized for low-temperature experiments, QCT Cantilevers offer unmatched sensitivity, robustness, and performance for advanced research applications. The V-shaped triple-beam TLCQCT3-V is custom-engineered to provide improved mechanical stability and signal transfer.
Applications
- Low-temperature-AFM / KPFM
- Probing quantum coherence, tunneling phenomena, and spin dynamics
- Quantum Twisting Microscopy
- Sensitive force detection in cryogenic environments
What about your application?
TLCQTC Series: Specifications
| Parameter | Value (all models) |
|---|---|
| Material | SiN with a polymer core |
| Tip material | Tipless |
| Modes | Low-temperature compatible |
| Pt metal thickness | 70 nm |
| Dimensions* (length × width × thickness) | 300 µm × 80 µm × 4 µm |
| Nominal res. freq. | 50 kHz |
| Nominal spring const. | 5 N/m |
| Deflection sensitivity** | 2 µV/nm |
| Deflection sensing | On-chip piezoresistive bridge |
| Actuator | External shaker |
| Electrical connections | Unbonded (bare chip) |
Model Differences
| Model | No. of Pt traces to tip | Support beam width |
|---|---|---|
| TLCQTC1 | 2 | - |
| TLCQTC2 | 4 | - |
| TLCQTC3 | 6 | - |
| TLCQTC3-V | 6 | 40 µm |
* Dimensions of the main beam.
** Nominal value. Not amplified, 2.048 V bridge supply.
References: Hosseini, N., et al. Nature Electronics, 2024 · DOI: 10.1038/s41928-024-01195-z
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